shenzhen mysterious chemical technology co., ltd.

number
 name application direct selling point dosage
1
 TYL electroplating leveler common PCB electroplating 1-50ppm
2
 VPL1 electroplating leveler VCP high current, 2-4asd, more than one year, no anode film off 30-60ppm
3
 VPL2 electroplating leveler VCP high current, 2-5asd, more than one year, no anode film off, no need to add SPS 40-50ppm
4
 TYL electroplating leveler Through hole and blind hole plating are carried out at the same time, and the difference of TP is smaller 5-10ppm
5
 TKL electroplating leveler Hole filling electroplating, dimple less than 5% 10-100ppm
6
 FPL electroplating leveler Flexible plate electroplating, 0.1-0.3 aperture, TP = 150-250% 5-10.5ppm
7
 JM-1 electroplating wetting agent Instead of traditional 50hb-400, it has high current resistance and higher TP 100-500ppm
8
 JM-2 electroplating wetting agent Replacing the traditional 50hb-400, it has higher TP effect 100-500ppm
9
 JM-3 electroplating wetting agent Pulse direction, with longer TP stability and tank liquid life 2-3g/L
10
 CP22 lowfoam cleanning surfactant Focus on cleaning and removing grease before copper plating, 20-30g / L, t = 18-22 ℃ 2-3%
11
 CP29 lowfoam cleanning surfactant Focus on cleaning and removing grease before copper plating, 20-30g / L, t =2529 ℃ 2-3%
12
 CP36 lowfoam cleanning surfactant Focus on cleaning and removing grease before copper plating，2-5g/L,T=36-40℃ 2-4g/L
13
 CP38 lowfoam cleanning surfactant Focus on cleaning and removing grease before copper plating，20-30g/L,T=38-45℃ 2-3%
14
 CP60 lowfoam cleanning surfactant Focus on metal surface pretreatment, degreasing and cleaning，1-5g/L,T=50-60℃ 1-5G/L
15
 CP85 lowfoam cleanning surfactant Focus on metal surface pretreatment, degreasing and cleaning，1-5g/L,T=80-85℃ 1-5G/L
16
 AT50 Solubilizer Focus on strong alkaline glass cleaning to improve cleaning capacity 1-5%
17
 WG1 defoamer no silicon Focus on strong alkaline glass cleaning, improve cleaning capacity, focus on industrial cleaning agent, with higher transparency 0.03%-0.1%
18
 WG2 defoamer no silicon Focus on the development of defoamer with silicon-free defoamer, 1-5ml / L, long antifoam ability 1-5ml/L
19
 XP30 defoamer with oganic silicon Focus on defoamer in developing and stripping film 200ppm
20
 XY28 developer additive Focus on adding raw materials to the developer, with low foam, easy to disperse the developing components 0.5-1%
21
 XY80 developer additive Focus on adding raw materials to the developer, with low foam, easy to disperse the developing components 0.1-0.5%
22
 TY1 stripping additive Focus on alkaline non foam green oil material, non foam, strong alkali resistance, good wettability 5-10%
23
 WS50 microetching additive Focus on sulfuric acid hydrogen peroxide micro etchant, especially in the bright direction of soft board, hydrogen peroxide stabilizer 1-2%
24
 ZK400 cationic polymer cationic polymer for FPC 1-5G/L
25
 ZK101 cationic polymer Cationic raw material of conductive adhesive pore finishing agent 1-5G/L
26
 ZK850 cationic polymer Cationic raw material of ceramic substrate pore forming agent 1-5G/L
27
 ZK100 cationic polymer Cationic raw material for thick plate finishing agent 1-5G/L
28
 ZK-TFL cationic polymer High frequency plate whole hole cation raw material 1-5G/L
29
 ZK-80 nonic surfactant High frequency plate pore forming cationic raw material, pore forming agent, non-ionic raw material, high cloud point, high wetting capacity, high permeability 1-5G/L
30
 WS65 etching additive Reduce the width of upper and lower shoulder for high precision etching, sulfuric acid, hydrogen peroxide, copper chloride system 1-5m/L